Rumor mill: AMD is preparing to debut its first Ryzen 9000 processor with 3D V-Cache on November 7. However, multiple leaks have already shed light on its performance. A detailed new leak seems to confirm the rumored specifications of the Ryzen 7 9800X3D, anticipated to be the flagship CPU in AMD’s forthcoming series.
Based on a listing on the European price comparison website Geizhals, the Ryzen 7 9800X3D will boast eight Zen 5 cores and 16 threads. Reportedly, it provides a 4.7 GHz base clock and a 5.2 GHz boost clock—both higher than those of the 7800X3D, which features a 4.2 GHz base clock and a 5.0 GHz boost clock. The 9800X3D is also expected to feature a 120W TDP, consistent with the 7800X3D.
Regarding cache, the 9800X3D is listed as having 104MB of total cache: 8MB of L2 (8 x 1MB) and 96MB of L3 (32MB internal + 64MB stacked). It will support up to 192GB of dual-channel DDR5-5600 memory at one DIMM per channel. Additional specifications include support for 28 PCIe 5.0 lanes (24 accessible) and an RDNA 2 “Granite Ridge” iGPU clocked up to 2.2 GHz.
Additionally, the leak hints that the forthcoming Ryzen processors will be compatible with all AMD 600-series motherboards, such as the A620 and PRO workstation lines. It also indicates that the 9800X3D will utilize the same “GNR-B0” silicon as current models. Notably, the Tjmax has increased to 95 degrees Celsius from 89 degrees on the 7800X3D, aligning it with other Ryzen 9000 (non-X3D) CPUs.
The listing verifies that the 9800X3D will feature an unlocked multiplier, which is promising news for overclocking fans. If true, this would mark a significant change from the previous generation of 3D V-Cache CPUs, which had locked multipliers and didn’t support conventional overclocking.
AMD is anticipated to release official benchmarks for the 9800X3D next week. Nonetheless, recent leaks suggest it might provide up to an eight percent boost in gaming performance over the Ryzen 7 7800X3D. The leaked document also reaffirmed compatibility with all AM5 motherboards, including models featuring the X870E/X870 and X670(E)/B650(E) chipsets.
